DOWSIL™ ME-6820
One Part/No byproducts/Low modulus
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Description
DOWSIL™ ME-6820 Application description： wire coating and IC encapsulant for wire bonding package.
Additional information
| Brand | DOWSIL |
|---|---|
| Manufacturer SKU | |
| Application | Chip Coating |
| Market application | Semiconductor |
| Mix Ratio by Weight | One Part |
| Material | SILICONE |
| Color/Appearance | Black |
| Viscosity (mPa.s) | 6,000 |
| Tack-Free Time | N/A |
| Cure Condition | 60 mins @ 150℃ |
| Specific Gravity | 1.3 |
| Hardness (Shore) | 52 (A) |
| Tensile Strength (psi) | 565 |
| Dielectric Strength (KV/mm ) | 18 |
| Volume Resistivity (ohm*cm) | 3.20E+15 |
More Information
If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.
