DOWSIL™ ME-6820

One Part/No byproducts/Low modulus

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Description

DOWSIL™ ME-6820 Application description: wire coating and IC encapsulant for wire bonding package.

Additional information
Brand

DOWSIL

Manufacturer SKU
Application

Chip Coating

Market application

Semiconductor

Mix Ratio by Weight

One Part

Material

SILICONE

Color/Appearance

Black

Viscosity (mPa.s)

6,000

Tack-Free Time

N/A

Cure Condition

60 mins @ 150℃

Specific Gravity

1.3

Hardness (Shore)

52 (A)

Tensile Strength (psi)

565

Dielectric Strength (KV/mm )

18

Volume Resistivity (ohm*cm)

3.20E+15

More Information

If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.

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