YINCAE SMT158 SERIES

One Part/Underfill Material/Rrapid curing/Fast flowing

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Description

YINCAE SMT158 Series Application description: A device that requires a specification reliability such as BGA FLIPCHIP.

Additional information
Brand

YINCAE

Application

Die Adhesive

Market application

Semiconductor

Mix Ratio by Weight

One Part

Material

EPOXY

Color/Appearance

Black, White

Viscosity (mPa.s)

35,000-80,000

C.T.E. (ppm/℃)

α1 = 35, α2 = 142

Cure Condition

15 mins @ 150℃, in line curing or reflow

Working Time (@25℃)

8 hrs

More Information

If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.

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