YINCAE SMT256 SERIES DIP ADHESIVES COLORLESS OR YELLOWISH,30CC-SYR

One Part/Solder Protective Material/Replace under fill material

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Description

YINCAE SMT256 Series Application description: A device that requires a specification reliability such as BGA FLIPCHIP.

Brand

YINCAE

Application

Die Adhesive

Market application

Semiconductor

Mix Ratio by Weight

One Part

Material

EPOXY

Color/Appearance

Colorless, Yellowish

Viscosity (mPa.s)

5,000-20,000

Cure Condition

Reflow Process (140℃~260℃)

Working Time (@25℃)

N/A

If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.

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